hybrid circuit造句

• Thin film hybrid circuit
  薄膜混合电路
• Hybrid circuit network
  混合电路网络
• A common short form used for " hybrid circuit " and " hybrid network " mainly in the plural
  通常以复数形式作为“混合电路”和“混合网络”的缩写。
• A common short form used for “ hybrid circuit ” and “ hybrid network ” mainly in the plural
  通常以复数形式作为“混合电路”和“混合网络”的缩写。
• Semiconductor devices - integrated circuits - sectional specification for semiconductor integrated circuits excluding hybrid circuits
  半导体器件.集成电路.半导体集成电路
• Semiconductor devices ; integrated circuits ; part 11 : sectional specification for semiconductor integrated circuits excluding hybrid circuits
  半导体器件.集成电路.第11部分:半导体集成电路
• Semiconductors devices . integrated circuits . part 11 : sectional specification for semiconducteur integrated circuits excluding hybrid circuits
  半导体器件.集成电路.第11部分:半导体集成电路
• . 1 semiconductor devices - integrated circuits - part 11 : sectional specification for semiconductor integrated circuits excluding hybrid circuits ; amendment 1
  半导体器件.集成电路.第11部分:半导体集成电路
• Semiconductor devices ; integrated circuits ; part 11 ; section 1 : internal visual examination for semiconductor integrated circuits excluding hybrid circuits
  半导体器件.集成电路.第11部分第1节:半导体集成电路
• Semiconductor devices integrated circuits part11 : section 1 : internal visual examination for semiconductor integrated circuits excluding hybrid circuits
  半导体器件集成电路第11部分：第1篇：半导体集成电路内部目检不包括混合电路
• Semiconductor devices - integrated circuits - part 11 : sectional specification for semiconductor integrated circuits excluding hybrid circuits ; amendment 2
  半导体器件.集成电路.第11部分:不包括混合电路的半导体集成线路分规范.补充件2
• Manufacturer of high voltage resistors , power and precision resistors , high voltage dividers , hybrid circuits , resistor networks , pressure and force sensors and load cells
  -生产ai - 6000自动抗干扰精密介质损耗测量仪，氧化锌避雷器测试仪，地网接地电阻测试仪，油介损电阻率测量仪。
• Manufactures pressure sensors , transducers , load cells , accelerometers , force sensors and strain gages from stock . specialist in micro - miniaturization and applications of semiconductor , thin film , metallic foil and hybrid circuit technologies for the measurement of acceleration , force , and pressure in a multitude of environments
  -提供薄膜制备微粉制备真空冶金分子束外延磁控溅射化学气相沉积电子束镀膜激光镀膜甩带机磁控电弧炉空间环境模拟等设备
• In chapter l , the present state of locomotive load test is summarized ; the defect of water resistance - load and original resistance - load is analyzed ; then igbt being applied in resistance - load test bed is proposed and the trend of the thyristor is forsight in chapter 2 , the principle of igbt driving & protecting circuit is studied , and the dissertation introduces the hybrid circuit designed for driving igbt module and its protection technique
  第一章综述了目前国内机车负载实验的状况，分析了水阻试验台和原干阻试验台的缺陷，提出了采用igbt技术改造新的干阻试验台，并展望了功率半导体的发展前景。第二章研究了igbt的驱动和保护的原理和技术，并介绍了专用的驱动器m57962l和igbt的保护方法。
• Harmonized system of quality assessment for electronic components - semiconductor devices - integrated circuits - sectional specification for semiconductor integrated circuits excluding hybrid circuits - internal visual examination for semiconductor integrated circuits excluding hybrid circuits
  电子元器件质量评估协调体系.半导体器件.集成电路.不包括混合电路的半导体集成电路分规范.不包括混合电路的半导体集成电路分规范.不包括混合电路的半导体集成电路的内目测检验
• Abstract : abstract ： by analyzing the design principle of the shear strength test method for chips of semiconductor devices , it is conchuded that the chip quality is the basis for the determination of chip shear strength criterion , which in turn is the shear strength criterion for passive components in hybrid circuits
  摘要：摘要：通过对半导体器件的芯片剪切强度试验方法设计原理的分析，得出芯片质量是设定芯片剪切强度的依据，并以此作为混合集成电路中无源元件的剪切强度判据。